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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 484-BFBGA, FCBGA
Supplier Device Package 484-FCBGA (19x19)
Number of I/O 82
Base Product Number XCZU2
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Other Names 122-2255,XCZU2CG-2SBVA484I-ND
Standard Package 1
Win Source Part Number 1026502-XCZU2CG-2SBVA484I
Ultra Librarian 3D Model Ultra Librarian XCZU2CG-2SBVA484I CAD Model

Description

The XCZU2CG-2SBVA484I is a Zynq® UltraScale+™ MPSoC CG series integrated circuit (IC) with dual ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™ core processors.

  • Speed: 533MHz and 1.3GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • I/O Ports: 82
  • RAM Size: 256KB
  • Flash Size: None
  • Architecture: MCU and FPGA
  • Primary Attributes: Zynq® UltraScale+™ FPGA and 103K+ logic cells
  • Package/Case: 484-BFBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • MSL Level: 4 (72 Hours)
  • REACH: Unaffected
  • HTSUS Code: 8542.39.0001
  • Manufacturer: AMD Xilinx
  • Other Names: 122-2255 and XCZU2CG-2SBVA484I-ND

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Quantity Unit Price Ext. Price
1+ $559.8414 $559.8414
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Availability: 200 pieces
Order Increment : 1 piece
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