XC7Z045-1FFG676C Real Image
Same model may have multiple batches, images only for reference.

Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z045
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-1901
Standard Package 1
Win Source Part Number 1000768-XC7Z045-1FFG676C
Ultra Librarian 3D Model Ultra Librarian XC7Z045-1FFG676C CAD Model

Description

The XC7Z045-1FFG676C is an integrated circuit manufactured by AMD Xilinx.

  • Series: Zynq-7000
  • Processor: dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Speed: 667MHz
  • Package: tray

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $234.4651 $234.4651
2+ $210.2100 $420.4200
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 500 pieces
Order Increment : 1 piece
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