XCZU6CG-2FFVC900I Real Image
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU6
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 994563-XCZU6CG-2FFVC900I
Ultra Librarian 3D Model Ultra Librarian XCZU6CG-2FFVC900I CAD Model

Description

The AMD Xilinx Zynq® UltraScale+™ MPSoC CG is an embedded system on chip (SoC) with a dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5 with CoreSight™ core processor.

  • Speed: 533MHz and 1.3GHz
  • Primary Attribute: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • RAM Size: 256KB
  • Flash Size: -
  • Base Product Number: XCZU6
  • Packaging: Tray

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