XCZU17EG-2FFVB1517I Real Image
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Number of I/O 644
Base Product Number XCZU17
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1004751-XCZU17EG-2FFVB1517I
Ultra Librarian 3D Model Ultra Librarian XCZU17EG-2FFVB1517I CAD Model

Description

The XCZU17EG-2FFVB1517I is a system-on-chip integrated circuit that belongs to the Zynq UltraScale+ MPSoC EG series. It features a quad-core ARM Cortex-A53 MPCore with CoreSight, dual-core ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2, and a Zynq UltraScale+ FPGA with 926K+ logic cells. It is supplied by AMD Xilinx.

  • Speeds: 533MHz, 600MHz, and 1.3GHz
  • Temperature Range: -40°C to 100°C
  • I/Os: 644
  • RAM: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • Package: 1517-BBGA, FCBGA

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