XC7Z030-3FBG676E
Same model may have multiple batches, images only for reference.

Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1GHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z030
Standard Package 1 pcs
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Win Source Part Number 852614-XC7Z030-3FBG676E
Ultra Librarian 3D Model Ultra Librarian XC7Z030-3FBG676E CAD Model

Description

The XC7Z030-3FBG676E is a System on Chip (SoC) from the Zynq-7000 series by AMD.

  • Processor: Dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Speed: 1GHz
  • Application: Embedded
  • Package: Tray
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • I/O Pins: 130
  • RAM: 256KB
  • Architecture: MCU + FPGA
  • Mounting Type: Surface Mount
  • Package: 676-BBGA, FCBGA
  • Operating Temperature: 0°C to 100°C
  • Product Status: Active

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $268.8000 $268.8000
2+ $258.3000 $516.6000
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 1,000 pieces
Order Increment : 1 piece
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