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XC7Z045-1FFG900C

Part No XC7Z045-1FFG900C
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A9 667MHZ 900FCBGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 350K Logic Cells 667MHz 900-FCBGA (31x31)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 130
Base Product Number XC7Z045
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-1900
Standard Package 1
Win Source Part Number 1105703-XC7Z045-1FFG900C
Ultra Librarian 3D Model Ultra Librarian XC7Z045-1FFG900C CAD Model

Description

The XC7Z045-1FFG900C is a system on chip (SoC) integrated circuit (IC) belonging to the embedded - system on chip (SoC) category by AMD Xilinx.

  • Series: Zynq-7000
  • Core Processor: Dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Core Processor Speed: 667MHz
  • FPGA: Kintex™-7
  • Logic Cells: 350K
  • RAM Size: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA
  • Maximum Supply Voltage: 5.5V
  • Minimum Supply Voltage: 4.5V
  • Package: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • REACH: Unaffected
  • HTSUS: 8542.39.0001

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