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Same model may have multiple batches, images only for reference.
XC7Z007S-2CLG225E Amd
Same model may have multiple batches, images only for reference.

XC7Z007S-2CLG225E

Part No XC7Z007S-2CLG225E
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 766MHZ 225BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 766MHz
Primary Attributes Artix™-7 FPGA, 23K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 225-LFBGA, CSPBGA
Supplier Device Package 225-CSPBGA (13x13)
Number of I/O 54
Base Product Number XC7Z007
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Win Source Part Number 1380319-XC7Z007S-2CLG225E
Ultra Librarian 3D Model Ultra Librarian XC7Z007S-2CLG225E CAD Model

Description

The AMD XC7Z007S-2CLG225E is an embedded System On Chip (SoC) that belongs to the Zynq®-7000 series. AMD manufactures it.

  • Operating Temperature: 0°C ~ 100°C (TJ)
  • MSL: 3 (168 Hours)
  • Package / Case: 225-LFBGA, CSPBGA
  • Base Part Number: XC7Z007
  • Mounting Type: Surface Mount
  • Speed: 766MHz
  • Processor Core: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA
  • RAM Size: 256KB
  • Architecture: MCU, FPGA
  • Primary Attributes: Artix™-7 FPGA with 23K Logic Cells

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3+ $40.1744 $120.5232
5+ $38.9189 $194.5945
7+ $37.6634 $263.6438
8+ $36.4079 $291.2632
11+ $32.6415 $359.0565
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