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XAZU7EV-1FBVB900Q

Part No XAZU7EV-1FBVB900Q
Manufacturer Amd
Catalog OEM Souring
Description FPGA SoC
Sample
Rohs State rohs
ECAD Module
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Category OEM Souring
Win Source Part Number 1464005-XAZU7EV-1FBVB900Q
Manufacturer Amd
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature -40°C ~ 125°C (TJ)
Grade -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Ultra Librarian 3D Model Ultra Librarian XAZU7EV-1FBVB900Q CAD Model

Description

The XAZU7EV-1FBVB900Q is a cutting-edge FPGA (Field-Programmable Gate Array) SoC (System-on-Chip) component designed by AMD/Xilinx, a leader in the semiconductor industry. This device is categorized under components, specifically within the AMD subcategory, highlighting its production under a hallmark of innovation in programmable logic solutions. The XAZU7EV-1FBVB900Q integrates advanced processing capabilities alongside configurable logic, making it a versatile tool for developers working on highly complex and computation-intensive projects. Housed in a 900-pin FBVB (Fine Ball Grid Array) package, this FPGA SoC is designed for optimal performance in applications requiring rapid processing and high-density I/O operations such as video processing, signal processing, and high-speed communications. The integration of a SoC complements its FPGA capabilities, facilitating the development of highly efficient and customizable systems that can cater to the unique demands of modern technology projects.

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