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Same model may have multiple batches, images only for reference.
XCZU9EG-2FFVB1156I Real Image
Same model may have multiple batches, images only for reference.

XCZU9EG-2FFVB1156I

Part No XCZU9EG-2FFVB1156I
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 1156FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Xilinx Inc.
Packaging Tray
Architecture MCU, FPGA
Core Processor Quad ARM Cortex -A53 MPCore with CoreSight , Dual ARM Cortex -R5 with CoreSight , ARM Mali -400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq UltraScale+ FPGA, 599K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Manufacturer Pack Quantity 1
MSL Level 4 (72 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 813323-XCZU9EG-2FFVB1156I
Ultra Librarian 3D Model Ultra Librarian XCZU9EG-2FFVB1156I CAD Model

Description

The Xilinx Inc. XCZU9EG-2FFVB1156I is a Zynq UltraScale+ FPGA.

  • Logic Cells: 599K+
  • Processors: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • I/O: 328
  • RAM Size: 256KB
  • Manufacturer Package: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
  • Temperature Range: -40°C to 100°C
  • MSL Level: 4 (72 hours)
  • Popularity: Low
  • Supply and Demand Status: Limited

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