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Same model may have multiple batches, images only for reference.
XCZU19EG-L2FFVC1760E
Same model may have multiple batches, images only for reference.

XCZU19EG-L2FFVC1760E

Part No XCZU19EG-L2FFVC1760E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A53 1760FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Number of I/O 512
Base Product Number XCZU19
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1191583-XCZU19EG-L2FFVC1760E
Ultra Librarian 3D Model Ultra Librarian XCZU19EG-L2FFVC1760E CAD Model

Description

This electronic component is an AMD Xilinx manufactured product with the Win Source Part Number of 1191583-XCZU19EG-L2FFVC1760E.

  • Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Processor Core: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Processor Speed: 533MHz, 600MHz, 1.3GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • I/O: 512
  • RAM Size: 256KB
  • FPGA: Zynq® UltraScale+™ FPGA with 1143K+ logic cells
  • Package/Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
  • Operating Temperature: 0°C to 100°C (TJ)

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