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XCZU27DR-2FSVE1156E

Part No XCZU27DR-2FSVE1156E
Manufacturer Xilinx Inc.
Catalog Embedded Processors and Controllers
Description FPGA Zynq UltraScale+ 930300 Cells 775MHz 16nm 0.85V 1156-Ball BGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Max Frequency 4 GHz
Max Operating Temperature 100 °C
Number of ADC Channels 8
Number of Transceivers 16
RAM Size 1.6 MB
Speed Grade -2
Win Source Part Number 1183666-XCZU27DR-2FSVE1156E
Categories Embedded Processors and Controllers
Manufacturer Xilinx Inc.
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XCZU27DR-2FSVE1156E CAD Model

Description

The Xilinx XCZU27DR-2FSVE1156E is a Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip) device. This highly integrated device combines a multi-core ARM processor system with programmable logic and high-speed RF data converters, making it suitable for a wide range of applications requiring high performance and flexibility.

Applications

  • Wireless communication systems
  • Radar systems
  • Test and measurement equipment
  • Aerospace and defense applications
  • Software-defined radio (SDR)

Features

  • Integrated ARM Cortex-A53 and Cortex-R5 processors
  • UltraScale+ programmable logic
  • Integrated RF data converters (ADCs and DACs)
  • High-speed serial interfaces (e.g., PCIe, Ethernet)
  • Advanced security features

Benefits

  • Reduced system size and complexity through high integration.
  • Improved performance with powerful processing capabilities and fast data converters.
  • Increased flexibility with programmable logic for custom hardware acceleration.
  • Lower power consumption compared to discrete solutions.
  • Enhanced security features for secure applications.

Additional Details

The XCZU27DR-2FSVE1156E integrates multiple ARM Cortex-A53 cores for application processing and ARM Cortex-R5 cores for real-time control. The UltraScale+ programmable logic provides a flexible platform for implementing custom hardware accelerators and signal processing algorithms. The integrated RF data converters (ADCs and DACs) enable direct connection to RF signals, eliminating the need for external data converters in many applications. The device supports various high-speed serial interfaces, such as PCIe and Ethernet, for high-bandwidth communication. The advanced security features include hardware encryption and secure boot capabilities. The "FSVE1156" in the part number refers to the package type (Fine Pitch Ball Grid Array with 1156 balls). The "-2" indicates the speed grade of the device. Detailed specifications include the number of logic cells, memory size, ADC/DAC sample rates, interface speeds, and operating temperature range. The Zynq UltraScale+ RFSoC devices are typically programmed using Xilinx's Vivado Design Suite. These devices are used in demanding applications where high performance, low power consumption, and flexibility are critical. The integration of RF data converters significantly reduces the complexity and cost of RF systems. The device is designed to meet the stringent requirements of aerospace, defense, and wireless communication applications.

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Pricing & Ordering

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1+ $740.1761 $740.1761
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Availability: 155 pieces
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