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XCV400E-6FG676C0773

Part No XCV400E-6FG676C0773
Manufacturer Xilinx Inc.
Catalog Hard To Find
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 1017+
Reference case BGA
Manufacturer Xilinx Inc.
Win Source Part Number 717068-XCV400E-6FG676C0773
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XCV400E-6FG676C0773 CAD Model

Description

The XCV400E-6FG676C0773 is a Virtex-E Field-Programmable Gate Array (FPGA) manufactured by Xilinx Inc. This FPGA is part of the Virtex-E family, which is known for its high performance and flexible architecture. It allows designers to implement custom digital circuits and systems by configuring the internal logic blocks and interconnects. The XCV400E-6FG676C0773 offers a balance of logic density, memory, and I/O capabilities, making it suitable for a wide range of applications.

Applications

  • Digital signal processing (DSP)
  • Image processing
  • Networking equipment
  • Telecommunications
  • Industrial automation
  • Aerospace and defense
  • Embedded systems

Features

  • 400,000 system gates
  • Configurable logic blocks (CLBs)
  • Block RAM memory
  • Distributed RAM memory
  • Digital clock managers (DCMs)
  • Input/Output Blocks (IOBs)
  • 676-pin Fine-Pitch Ball Grid Array (FBGA) package
  • -6 speed grade

Benefits

  • High performance and flexibility
  • Customizable hardware implementation
  • Reduced time-to-market
  • Increased system integration
  • Reprogrammable architecture
  • High I/O count for complex interfaces

Additional Details

The XCV400E-6FG676C0773 features a significant number of configurable logic blocks (CLBs) that can be interconnected to implement complex digital functions. The on-chip block RAM provides dedicated memory resources for data storage and signal processing. The distributed RAM offers additional flexibility for smaller memory requirements. The digital clock managers (DCMs) enable precise clock control and management, ensuring optimal system performance. The Input/Output Blocks (IOBs) support a variety of interface standards, allowing the FPGA to communicate with external devices.

The 676-pin Fine-Pitch Ball Grid Array (FBGA) package provides a high density of I/O pins, enabling complex interfaces and high-speed data transfer. The -6 speed grade indicates a specific performance level, allowing designers to select the appropriate FPGA for their application requirements. The XCV400E-6FG676C0773 is a powerful and versatile FPGA that enables designers to create custom hardware solutions for a wide range of applications, offering a combination of performance, flexibility, and integration capabilities.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $85.6259 $85.6259
2+ $82.9498 $165.8996
3+ $80.2748 $240.8244
4+ $77.5987 $310.3948
5+ $69.5714 $347.8570
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 2,000 pieces
Order Increment : 1 pcs
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