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XCV200-4BGG256C

Part No XCV200-4BGG256C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description Xilinx 256BGA
Sample
Rohs State rohs
ECAD Module
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Number of Gates 236666
RoHS Compliant
Win Source Part Number 988538-XCV200-4BGG256C
Categories Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCV200-4BGG256C CAD Model

Description

The XCV200-4BGG256C is a Field-Programmable Gate Array (FPGA) from Xilinx Inc., belonging to the Virtex family. FPGAs are programmable integrated circuits that can be configured after manufacturing, allowing for flexible hardware implementation of digital circuits. The 'XCV200' indicates a specific density of logic resources, the '-4' represents a speed grade, 'BGG256' refers to the package type, and 'C' indicates the temperature grade.

Applications

  • Digital signal processing (DSP)
  • Image and video processing
  • Networking and communication systems
  • Embedded systems
  • Aerospace and defense applications

Features

  • Logic cells: Contains a specific number of configurable logic blocks (CLBs) arranged in an array. The XCV200 has approximately 2,808 logic cells.
  • Block RAM: Includes on-chip block RAM memory for data storage and processing.
  • I/O blocks: Provides a number of programmable input/output (I/O) blocks for interfacing with external devices. The BGG256 package likely specifies the number of I/Os available.
  • Clock management: Features dedicated clock management circuitry for generating and distributing clock signals.
  • Speed grade: The '-4' indicates a specific performance level in terms of clock frequency and propagation delay.
  • Package: BGG256 indicates a Ball Grid Array (BGA) package with 256 pins, suitable for surface mounting.
  • Temperature grade: 'C' commonly represents a commercial temperature grade.

Benefits

  • Flexibility: Allows for custom hardware implementation of digital circuits, adaptable to changing requirements.
  • Parallel processing: Enables parallel execution of algorithms, achieving high performance in computationally intensive applications.
  • Rapid prototyping: Reduces development time compared to custom ASIC design.
  • Reconfigurability: Can be reprogrammed in the field, allowing for bug fixes and feature upgrades.
  • Integration: Combines multiple functions into a single chip, reducing board space and cost.

The XCV200-4BGG256C offers a versatile platform for implementing a wide range of digital designs. For detailed specifications, including logic cell count, memory size, I/O details, and timing characteristics, refer to the official Xilinx Virtex family datasheet.

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