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XC3S700A-4FGG400I Real Image XC3S700A-4FGG400I Real Image
Same model may have multiple batches, images only for reference.
XC3S700A-4FGG400I Real Image XC3S700A-4FGG400I Real Image
XC3S700A-4FGG400I Real Image XC3S700A-4FGG400I Real Image
Same model may have multiple batches, images only for reference.

XC3S700A-4FGG400I

Part No XC3S700A-4FGG400I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 311 I/O 400FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits
Manufacturer Xilinx Inc.
Number of LABs/CLBs 1472
Number of Logic Elements/Cells 13248
Total RAM Bits 368640
The number of I/O 311
Number of Gates 700000
Supply Voltage (V) 1.14V ~ 1.26V
Mounting Style SMD
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 400-BGA
Supplier Device Package 400-FBGA (21x21)
Family Part Number XC3S700A
Manufacturer Pack Quantity 60
MSL Level 3 (168 Hours)
Win Source Part Number 758739-XC3S700A-4FGG400I
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3S700A-4FGG400I CAD Model

Description

The Xilinx Inc. XC3S700A-4FGG400I is an integrated circuit with 1472 LABs/CLBs, 13248 logic elements/cells, and 368640 total RAM bits.

  • Voltage Supply: 1.14 V to 1.26 V
  • I/Os: 311
  • Package: 400-FBGA (21x21)
  • Temperature Range: -40°C to 100°C

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