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XC3S200A-4FTG256I

Part No XC3S200A-4FTG256I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 195 I/O 256FTBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits
Manufacturer Xilinx Inc.
Status Active
Number of LABs/CLBs 448
Number of Logic Elements/Cells 4032
Total RAM Bits 294912
Number of I/O 195
Number of Gates 200000
Supply Voltage - Operating 1.14 V to 1.26 V
Mounting SMD (SMT)
Temperature Range - Operating -40°C to 100°C (TJ)
Case / Package 256-FTBGA (17x17)
Win Source Part Number 037195-XC3S200A-4FTG256I
Is this a common-used part? Yes
Popularity High
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian XC3S200A-4FTG256I CAD Model

Description

The XC3S200A-4FTG256I is a Field-Programmable Gate Array (FPGA) from the Xilinx Spartan-3A family. It's designed to provide a flexible, reprogrammable hardware platform for a variety of digital logic applications, offering a compromise between performance, power consumption, and logic resources.

Applications:

  • Industrial Control: Implementing custom controllers, data acquisition systems, and automation logic.
  • Consumer Electronics: Used in digital TVs, set-top boxes, and multimedia devices for signal processing and control functions.
  • Automotive Systems: Integrated in vehicle control systems, driver assistance features, and infotainment units.
  • Communication Equipment: Employed in wireless communication devices, networking hardware, and data transmission systems.
  • Medical Devices: Used in medical imaging equipment, diagnostic tools, and patient monitoring systems.

Features:

  • Logic Cells: Provides approximately 4,320 logic cells, allowing for complex digital circuit implementations.
  • Block RAM: Includes dedicated block RAM for on-chip memory storage.
  • Distributed RAM: Features distributed RAM resources for smaller memory requirements.
  • Digital Clock Managers (DCMs): Equipped with DCMs for clock frequency generation and management.
  • I/O Pins: Offers a defined number of I/O pins (256-pin FTG package) for interfacing with external devices.
  • Operating Voltage: Operates at a specific core voltage to ensure compatibility with digital logic levels.
  • Temperature Grade: Available in different temperature grades to support various operating environments.
  • Configuration Options: Supports multiple configuration methods, including JTAG and SPI.

Benefits:

  • Flexibility: Enables design changes and customization without requiring hardware modifications.
  • Time-to-Market: Reduces development time by allowing rapid prototyping and iteration.
  • Cost-Effectiveness: Offers a cost-efficient alternative to custom ASICs for low to medium volume applications.
  • Performance: Provides a balance of performance and power consumption for digital logic applications.
  • Integration: Integrates key features such as RAM, clock management, and I/O interfaces on a single chip.

Technical Specifications: The XC3S200A-4FTG256I operates at a core voltage of around 1.2V. It comes in a 256-pin FTG package. It incorporates block RAM, distributed RAM, and digital clock managers. The 'I' at the end of the part number signifies Industrial temperature grade, and '-4' corresponds to a specific speed grade.

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $21.3442 $64.0326
6+ $17.5132 $105.0792
9+ $16.9659 $152.6931
13+ $16.4186 $213.4418
16+ $15.8714 $253.9424
22+ $14.2295 $313.0490
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 9,000 pieces
MOQ: 3 pcs
Order Increment : 1 pcs
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