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TG-UTB01532S

Part No TG-UTB01532S
Manufacturer Umec
Catalog HOT - SALES and EOL Components (T)
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Manufacturer Umec
Win Source Part Number 365236-TG-UTB01532S
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian TG-UTB01532S CAD Model

Description

The TG-UTB01532S is a thermal gap filler pad manufactured by Umec. These pads are designed to provide efficient thermal transfer between heat-generating components and heat sinks or other cooling devices. They are crucial for maintaining optimal operating temperatures and preventing overheating in electronic devices.

Applications

  • Power Supplies
  • Automotive Electronics
  • LED Lighting
  • Telecommunications Equipment
  • Consumer Electronics (e.g., laptops, desktops, gaming consoles)

Features

  • High Thermal Conductivity: Offers efficient heat dissipation, ensuring components operate within safe temperature ranges.
  • Soft and Conformable: Easily conforms to uneven surfaces, providing excellent contact and minimizing air gaps.
  • Electrical Insulation: Provides electrical isolation between components, preventing short circuits and ensuring safety.
  • Easy Application: Can be easily cut and applied to the desired surface, simplifying the assembly process.
  • Durable and Reliable: Offers long-term stability and performance, maintaining thermal conductivity over time.

Benefits

  • Improved Thermal Management: Effectively dissipates heat, preventing overheating and ensuring stable operation of electronic devices.
  • Enhanced Reliability: Reduces the risk of component failure due to excessive heat, extending the lifespan of electronic devices.
  • Simplified Assembly: Easy to apply and conform to various surfaces, streamlining the manufacturing process.
  • Cost-Effective Solution: Provides a reliable and efficient thermal management solution at a competitive price.
  • Versatile Application: Suitable for a wide range of electronic devices and applications, offering flexibility in design and manufacturing.

These thermal gap filler pads are typically made from silicone-based materials with high thermal conductivity fillers. The specific thermal conductivity value varies but is generally in the range of 1 to 5 W/mK. The thickness of the pad also varies, allowing for customization based on the specific application requirements. The TG-UTB01532S pad offers excellent performance and reliability, making it an ideal choice for demanding thermal management applications.

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Pricing & Ordering

Quantity Unit Price Ext. Price
70+ $0.8813 $61.6910
160+ $0.7242 $115.8720
250+ $0.7011 $175.2750
345+ $0.6780 $233.9100
445+ $0.6560 $291.9200
590+ $0.5879 $346.8610
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 3,728 pieces
MOQ: 70 pcs
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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