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THGBMFG9C4LBAIR

Part No THGBMFG9C4LBAIR
Manufacturer Toshiba Semiconductor and Storage
Catalog OEM Parts (T - Z)
Description NAND Flash Serial e-MMC 1.8V/3.3V 512G-bit 512G/128G/64G x 1/4-bit/8-bit 153-Pin FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Density 512 Gb
Maximum Operating Temperature 85 °C
Min Operating Temperature -25 °C
Mount Surface Mount
RoHS Compliant
Win Source Part Number 996618-THGBMFG9C4LBAIR
Categories OEM Parts(T-Z)
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian THGBMFG9C4LBAIR CAD Model

Description

The THGBMFG9C4LBAIR is a Toshiba Semiconductor and Storage manufactured OEM part that falls under the T-Z category. Bold the product name (e.g., BAV99S,135 → BAV99S,"135") and manufacturer (e.g., Nexperia USA Inc. → Nexperia USA Inc.).

  • Density: 512 Gb
  • RoHS: Compliant
  • Supply and Demand Status: Shortage
  • Win Source Part Number: 996618-THGBMFG9C4LBAIR
  • Maximum Operating Temperature: 85 °C
  • Minimum Operating Temperature: -25 °C

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $17.7272 $53.1816
7+ $14.5454 $101.8178
11+ $14.0909 $154.9999
15+ $13.6364 $204.5460
19+ $13.1818 $250.4542
26+ $11.8182 $307.2732
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 550 pieces
MOQ: 3 pcs
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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