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TC58CVG1S3HRAIGBAH

Part No TC58CVG1S3HRAIGBAH
Manufacturer Toshiba Semiconductor and Storage
Catalog OEM Parts (T - Z)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1028629-TC58CVG1S3HRAIGBAH
Categories OEM Parts(T-Z)
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian TC58CVG1S3HRAIGBAH CAD Model

Description

The TC58CVG1S3HRAIGBAH is a NAND flash memory device manufactured by Toshiba Semiconductor and Storage. This memory chip is designed for mass storage applications, offering high density and non-volatile data retention. It is commonly used in solid-state drives (SSDs), USB flash drives, memory cards, and other storage devices.

Applications:

  • Solid-state drives (SSDs): Used as the primary storage medium in SSDs for laptops, desktops, and servers.
  • USB flash drives: Employed in USB flash drives for portable data storage.
  • Memory cards: Found in memory cards such as SD cards, microSD cards, and CompactFlash cards for cameras, smartphones, and other devices.
  • Embedded systems: Integrated into embedded systems requiring non-volatile memory storage.
  • Mobile devices: Used in smartphones, tablets, and other mobile devices for storing operating systems, applications, and user data.

Features:

  • NAND flash memory: Offers high density and non-volatile data retention.
  • High-speed data transfer: Supports fast read and write operations.
  • Low power consumption: Designed for low power operation, suitable for portable devices.
  • Error correction code (ECC): Incorporates ECC to ensure data integrity.
  • Wear leveling: Distributes write operations evenly across the memory cells to extend the lifespan of the device.

Benefits:

  • High storage capacity: Provides ample storage space for applications, data, and media files.
  • Fast performance: Enables quick boot times, application loading, and data transfer speeds.
  • Low power consumption: Extends battery life in portable devices.
  • Data reliability: ECC and wear leveling ensure data integrity and prolong the lifespan of the memory device.

Additional Details:

The TC58CVG1S3HRAIGBAH typically uses a multi-level cell (MLC) or triple-level cell (TLC) architecture to store multiple bits of data per cell, increasing storage density. It utilizes advanced flash memory technology to achieve high performance and reliability. This memory device is often packaged in a small form factor to accommodate space-constrained applications. Understanding the page size, block size, and plane architecture is vital for effective use. The device's operating temperature and storage temperature ratings define allowable environmental parameters. Bad block management is a critical function for ensuring reliable data storage over the device's lifetime. The specific interface used (e.g., ONFI) influences how the flash memory communicates with the host controller.

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