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SNLVT573DBR

Part No SNLVT573DBR
Manufacturer Texas Instruments
Catalog Logic - Latches
Description SNLVT573DBR / Channel IC
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Logic - Latches
Mfr Texas Instruments
Series *
Package Bulk
Standard Package 1
RoHS Status Not applicable
MSL Level 3 (168 Hours)
HTSUS 0000.00.0000
Win Source Part Number 1342230-SNLVT573DBR
Ultra Librarian 3D Model Ultra Librarian SNLVT573DBR CAD Model

Description

The Texas Instruments SNLVT573DBR is a high-performance, octal transparent D-type latch with 3-state outputs, designed for 2.7-V to 3.6-V VCC operation. It is a significant component in digital systems, particularly in applications where temporary data storage and transfer are required. The device is part of the SNLVT series, which is known for its low-voltage operation and compatibility with TTL levels.

Key Features

  • Logic Type: Octal Transparent D-Type Latch
  • Output Type: 3-State
  • Operating Voltage: 2.7V to 3.6V
  • IC Package Type: SSOP (Shrink Small-Outline Package)
  • Pin Count: 20
  • Data Flow: Bidirectional
  • Propagation Delay Time: Fast propagation delay time, ensuring quick response to input changes

Product Applications

The SNLVT573DBR is ideal for a wide array of applications, including:

  • Temporary storage of data
  • Data transceivers
  • Communication systems
  • Microprocessor or microcontroller systems
  • Buffer memory
  • Address registers

Quality and Reliability

Texas Instruments is renowned for its commitment to quality and reliability, and the SNLVT573DBR is no exception. It is designed to meet the rigorous standards of the industry, ensuring high performance and durability for critical applications.

Environmental Compliance

The SNLVT573DBR complies with RoHS standards, reflecting Texas Instruments' dedication to environmental responsibility and the production of eco-friendly components.

Ordering and Packaging

Each SNLVT573DBR comes in a tape and reel packaging, facilitating efficient assembly during the manufacturing process. The device's SSOP-20 package is optimized for space-saving on printed circuit boards, making it an excellent choice for compact designs.

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