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K4B2G0846F-BCMA000

Part No K4B2G0846F-BCMA000
Manufacturer Samsung
Catalog OEM Parts (J - L)
Description DRAM Chip DDR3 SDRAM 2G-Bit 256M x 8 1.5V 78-Pin F-BGA
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Rohs State Need to verify
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RoHS Non-Compliant
Win Source Part Number 1066658-K4B2G0846F-BCMA000
Categories OEM Parts(J-L)
Manufacturer Samsung
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian K4B2G0846F-BCMA000 CAD Model

Description

The K4B2G0846F-BCMA000 is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) chip manufactured by Samsung. DDR3 SDRAM is a type of volatile memory commonly used in computers, laptops, and other electronic devices as main system memory. It provides fast data access for the processor.

Applications

  • Desktop computers
  • Laptop computers
  • Servers
  • Graphics cards
  • Gaming consoles

Features

  • DDR3 Technology: Utilizes DDR3 technology for high-speed data transfer.
  • 2Gb Density: Offers a memory density of 2 Gigabits.
  • x8 Configuration: Organized as 256M x 8 bits.
  • Operating Frequency: Supports high operating frequencies for fast data access.
  • Low Power Consumption: Designed for low power consumption to extend battery life in portable devices and reduce energy costs in servers.
  • Advanced Packaging: Comes in a compact package for surface mounting on PCBs.

Benefits

  • Improved System Performance: Fast data access speeds up application loading, multitasking, and overall system responsiveness.
  • Increased Memory Capacity: Provides ample memory for running multiple applications and handling large datasets.
  • Reduced Power Consumption: Low power consumption contributes to longer battery life in portable devices and lower energy costs in servers.
  • Enhanced Gaming Experience: Fast memory access improves gaming performance by reducing loading times and increasing frame rates.

Additional Details

The K4B2G0846F-BCMA000 operates over a specified voltage range. It is designed to meet the JEDEC standards for DDR3 SDRAM. The chip's advanced packaging ensures reliable performance and easy integration into system designs. It is crucial for applications demanding high bandwidth and low latency memory access.

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