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Same model may have multiple batches, images only for reference.
BR24G32FVJ-3GTE2 Real Image
Same model may have multiple batches, images only for reference.

BR24G32FVJ-3GTE2

Part No BR24G32FVJ-3GTE2
Manufacturer Rohm Semiconductor
Catalog EEPROM
Description IC EEPROM 32KBIT I2C 8TSSOP
Datasheet
BR24G32FVJ-3GTE2 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features EEPROM Memory IC 32Kb (4K x 8) I²C 8-TSSOP-BJ
Manufacturer Rohm Semiconductor
Package Reel - TR
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Case / Package 8-TSSOP-BJ
Family Name BR24G32
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0051
Other Part Number BR24G32FVJ-3GT2DKR, BR24G32FVJ-3GT2CT, BR24G32FVJ-3GTE2DKR, BR24G32FVJ-3GTE2CT, BR24G32FVJ-3GT2TR, BR24G32FVJ-3GTE2TR-ND, BR24G32FVJ-3GTE2CT-ND, BR24G32FVJ-3GTE2DKR-ND, BR24G32FVJ-3GTE2TR
Quantity per package 2500
Popularity High
Supply and Demand Status Balance
Win Source Part Number 913507-BR24G32FVJ-3GTE2
Ultra Librarian 3D Model Ultra Librarian BR24G32FVJ-3GTE2 CAD Model

Description

The Rohm Semiconductor BR24G32FVJ-3GTE2 is an EEPROM memory IC with a capacity of 32Kb (4K x 8) and is designed for use in a wide range of electronic devices.

  • Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting: surface mountable
  • Operating Temperature: -40°C to 85°C (TA)
  • REACH: unaffected
  • Estimated Production Lead Time: 51 weeks
  • Applications: automotive, industrial, and consumer electronics

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