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QFE3100

Part No QFE3100
Manufacturer Qualcomm
Catalog Electronic Wholesale
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 16
Reference case BGA
Manufacturer QUALCOMM
Win Source Part Number 755792-QFE3100
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian QFE3100 CAD Model

Description

The QFE3100 is a front-end module (FEM) manufactured by Qualcomm. It is designed for use in mobile devices to enhance cellular connectivity. The QFE3100 integrates multiple components to optimize signal transmission and reception, ensuring reliable and efficient wireless communication.

Applications

  • Mobile Phones: Primary application is in smartphones and cellular devices to improve RF performance.
  • Tablets: Used in tablet devices to enhance cellular connectivity and data transmission.
  • IoT Devices: Integrated into IoT devices requiring cellular communication for data transfer and control.
  • Portable Hotspots: Employed in portable hotspots to provide reliable internet connectivity through cellular networks.
  • Automotive Telematics: Utilized in automotive telematics systems for connectivity and data services.

Features

  • Multi-Band Support: Supports multiple frequency bands for global cellular network compatibility.
  • Integrated Power Amplifier (PA): Includes a high-efficiency power amplifier to boost signal transmission strength.
  • Antenna Switch: Features an integrated antenna switch for optimal antenna selection.
  • Low Noise Amplifier (LNA): Incorporates a low noise amplifier to improve signal reception sensitivity.
  • Compact Design: Designed in a compact package for easy integration into mobile devices.

Benefits

  • Enhanced Cellular Performance: Improves signal strength and quality, resulting in better call quality and data speeds.
  • Global Compatibility: Supports multiple frequency bands, enabling operation on various cellular networks worldwide.
  • Efficient Power Consumption: Optimized for low power consumption, extending battery life in mobile devices.
  • Reduced Board Space: Integration of multiple components reduces the need for discrete components, saving board space.
  • Improved Reliability: High-quality components and design ensure reliable performance in demanding environments.

Additional Details

The QFE3100 is designed to work with Qualcomm's modem and transceiver chipsets, providing a complete RF front-end solution. It is optimized for 4G LTE and other cellular technologies. The module is typically surface-mounted onto the printed circuit board (PCB) of mobile devices.

Technical Specifications (Typical):

  • Frequency Bands: Varies depending on specific model
  • Operating Voltage: 2.8V - 5.0V
  • Power Amplifier Gain: Varies depending on frequency band
  • Noise Figure: Low noise figure for improved sensitivity
  • Operating Temperature: -30°C to +85°C

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Pricing & Ordering

Quantity Unit Price Ext. Price
23+ $2.6091 $60.0093
54+ $2.1414 $115.6356
84+ $2.0744 $174.2496
116+ $2.0074 $232.8584
149+ $1.9404 $289.1196
200+ $1.7394 $347.8800
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 4,680 pieces
MOQ: 23 pcs
Order Increment : 1 pcs
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