The TCH35P47R0JE is a high-power thick film chip resistor manufactured by Ohmite. It is designed for surface mounting and is suitable for applications requiring high power dissipation and excellent pulse handling capabilities. This resistor is commonly used in power supplies, motor drives, and other industrial applications.

Applications:

• Power supplies: Used as current sensing or bleeder resistors in power supplies.
• Motor drives: Employed in motor drive circuits for current limiting and braking.
• Inrush current limiting: Used to limit inrush current during startup of electronic devices.
• Snubber circuits: Implemented in snubber circuits to protect switching devices from voltage transients.
• High-power amplifiers: Can be found in high-power amplifier circuits.

Features:

• High power rating: Can handle up to 35 watts of power dissipation.
• Low inductance: Minimizes parasitic inductance for high-frequency applications.
• Thick film construction: Provides excellent stability and reliability.
• Surface mount design: Suitable for automated assembly processes.
• RoHS compliant: Environmentally friendly and compliant with industry standards.

Benefits:

• Compact size: Offers a high power rating in a relatively small package.
• Improved reliability: Thick film construction ensures long-term stability and reliability.
• Reduced board space: Surface mount design saves board space.
• Easy assembly: Suitable for automated assembly processes.
• High pulse load capability: Can withstand high energy pulses.

Additional Details:

The TCH35P47R0JE has a resistance value of 47 ohms and a tolerance of 5%. It is important to consult the manufacturer's datasheet for detailed specifications such as temperature coefficient of resistance (TCR), voltage coefficient of resistance (VCR), and operating temperature range. Proper heatsinking is typically required to maintain the resistor within its operating temperature range, especially at higher power levels. The resistor is typically mounted on a printed circuit board (PCB) with appropriate thermal vias to dissipate heat effectively.