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74HC10N

Part No 74HC10N
Manufacturer NXP / Nexperia
Catalog Hard To Find
Description Triple 3-input NAND gate
Sample
Rohs State rohs
ECAD Module
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Manufacturer NXP
Win Source Part Number 1131475-74HC10N
Manufacturer Homepage www.nxp.com
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian 74HC10N CAD Model

Description

The 74HC10N is a high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL). Manufactured by NXP, a trusted name in the electronics industry, this product is part of the 74HC series, renowned for its robustness and versatility in various digital applications.

Key Features

  • Triple 3-input NAND Gate: The 74HC10N integrates three independent 3-input NAND gates in a single IC, offering compact and efficient logic gate solutions.
  • Operating Voltage: It operates on a wide range of voltages from 2V to 6V, making it suitable for interfacing with both TTL and CMOS technologies.
  • High Noise Immunity: The device is characterized by its high noise immunity and low power consumption, which is typical of CMOS integrated circuits.
  • Output Drive Capability: The 74HC10N can drive up to 10 LSTTL loads, providing sufficient current for most applications.
  • Speed: It boasts a propagation delay time that is significantly lower than that of LSTTL devices, ensuring faster response times for critical applications.

Applications

The 74HC10N is commonly used in a variety of digital circuits where NAND logic is required. Its applications include, but are not limited to:

  • Logic function generators
  • Computer logic
  • Data processing
  • Control systems
  • Signal processing

Quality and Reliability

NXP's commitment to quality ensures that the 74HC10N meets stringent industry standards for performance and reliability. Each device undergoes rigorous testing to guarantee optimal function in your digital systems.

Package Information

The 74HC10N is offered in a 14-pin DIP (Dual In-line Package), allowing for easy integration into a wide range of electronic circuits. The DIP package is suitable for through-hole mounting, which is preferred for prototyping and educational purposes due to its ease of handling and soldering.

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