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Manufacturer NEC
Win Source Part Number 389334-UPA2352BT1G-E4
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian UPA2352BT1G-E4 CAD Model

Description

The UPA2352BT1G-E4 is a P-channel MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) manufactured by NEC (now Renesas Electronics). It is designed for power management and switching applications that require high efficiency and low on-resistance. It is commonly used in portable devices, DC-DC converters, and load switching circuits.

Applications:

  • DC-DC Converters: Used in step-down (buck) and step-up (boost) voltage converters.
  • Load Switching: Efficiently switches power to various electronic loads.
  • Power Management Systems: Found in battery-powered devices for power distribution and control.
  • Motor Control: Used in low-power motor drive circuits.
  • LED Lighting: Can be used in LED driver circuits for dimming and current regulation.

Features:

  • P-Channel MOSFET: Simplifies high-side switching applications.
  • Low On-State Resistance (RDS(on)): Reduces power loss during conduction.
  • Fast Switching Speed: Enables efficient operation at higher frequencies.
  • Surface Mount Package: Allows for compact and automated assembly.
  • RoHS Compliant: Complies with environmental regulations for hazardous substances.

Benefits:

  • High Efficiency: Low RDS(on) minimizes power dissipation.
  • Small Footprint: Surface mount package reduces board space requirements.
  • Simplified Circuit Design: P-channel configuration simplifies drive circuitry.
  • Improved Thermal Performance: Efficient heat dissipation.
  • Environmentally Friendly: RoHS compliance reduces environmental impact.

Additional Details:

The UPA2352BT1G-E4 is characterized by its drain-source voltage (VDS), gate-source voltage (VGS), and drain current (ID). Consult the datasheet for the specific ratings. Thermal resistance junction to ambient (RθJA) is an important parameter. The gate charge affects switching performance. It is packaged for surface mounting to printed circuit boards (PCBs) and requires careful attention to soldering techniques and thermal management to ensure reliable operation. The datasheet provides information on the recommended soldering profile.

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