The Molex 501190-3047 is a SlimStack™ 0.40mm Pitch SMT Header. This header is designed for tight-packaging applications, providing reliable board-to-board connections in compact electronic devices. The SlimStack™ series is known for its low profile and space-saving design, making it suitable for high-density assemblies.

Applications

• Smartphones: Used for internal connections between PCB modules.
• Tablets: Employed to link display panels, camera modules, and main boards.
• Wearable Devices: Integrated in smartwatches, fitness trackers, and other compact wearables.
• Digital Cameras: Used to connect image sensors to the main processing unit.
• Medical Devices: Found in portable medical equipment for secure and compact interconnections.

Features

• 0.40mm Pitch: Provides high-density connectivity with minimal spacing.
• SlimStack™ Design: Low profile reduces overall height in compact devices.
• SMT (Surface Mount Technology): Facilitates automated assembly processes.
• 30 Circuits: Offers a high number of connections in a small footprint.
• Dual Row: Enhances contact reliability and signal integrity.
• High-Temperature Material: Suitable for reflow soldering processes.

Benefits

• Space Saving: Enables the design of smaller and thinner electronic devices.
• Reliable Connections: Ensures secure and stable board-to-board connections.
• Automated Assembly: SMT design supports efficient manufacturing processes.
• High-Density Connectivity: Allows for complex circuit designs in limited space.
• Improved Signal Integrity: Minimizes signal loss and interference in high-frequency applications.

Additional Details

The Molex 501190-3047 header is part of the SlimStack™ series, offering a 0.40mm pitch and 30 circuits in a dual-row configuration. It is designed for surface mount technology (SMT), which makes it suitable for automated assembly processes. The low-profile design is ideal for compact electronic devices such as smartphones, tablets, and wearable technology. The header uses high-temperature materials, allowing it to withstand reflow soldering temperatures without deformation. The compact design and reliable connections make it a popular choice for applications where space is limited but performance cannot be compromised.

The insulator material is LCP. The operating temperature is -40°C to +105°C.