The Molex 170335-5807 is a backplane connector designed for high-speed data transmission in demanding applications. These connectors are known for their robust construction, high signal integrity, and secure mating, ensuring reliable connections even in challenging environments. The 170335-5807 typically features a multi-pin configuration with specific pin assignments for various signals.
Applications:
- Server and networking equipment
- Data centers
- Telecommunications infrastructure
- Industrial automation systems
- High-performance computing
Features:
- High-speed data transmission capabilities
- Durable construction
- Secure mating
- Multi-pin configuration
- RoHS compliant
Benefits:
- Reliable connection: Ensures stable data transmission and minimizes signal loss.
- Robust design: Withstands harsh environments and frequent mating cycles.
- High performance: Supports high-speed data rates for demanding applications.
- Versatile: Suitable for a wide range of backplane applications.
- Environmentally friendly: RoHS compliant, minimizing environmental impact.
Additional Details:
The 170335-5807 backplane connector is designed to meet industry standards for performance and reliability. Its construction involves high-quality materials that provide excellent signal integrity and mechanical strength. The connector's design ensures proper alignment and secure mating with compatible backplane connectors. The materials used in the connector are chosen for their durability and resistance to corrosion. Molex backplane connectors are widely used in server systems, networking equipment, and telecommunications infrastructure. These connectors provide a dependable solution for data connectivity, ensuring seamless communication between different boards and modules. The connector is carefully designed to minimize crosstalk and electromagnetic interference (EMI), which is crucial for high-speed data transmission. These backplane connectors are essential components in many systems, ensuring proper connectivity and signal transmission between critical components.