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MT58LC64K36D8LG75

Part No MT58LC64K36D8LG75
Manufacturer Micron Technology Inc.
Catalog OEM Parts (M - N)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1008770-MT58LC64K36D8LG75
Categories OEM Parts(M-N)
Manufacturer Micron Technology Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian MT58LC64K36D8LG75 CAD Model

Description

The MT58LC64K36D8LG75 is a high-speed synchronous pipelined burst (SPB) SRAM module manufactured by Micron Technology Inc. It's designed for applications demanding rapid data access and high bandwidth. This SRAM module is a crucial component in systems where memory performance is paramount.

Applications:

  • Networking Equipment: Used in routers, switches, and other network devices for packet buffering and high-speed data storage.
  • Telecommunications Systems: Employed in base stations and other telecom infrastructure for signal processing and data transmission.
  • High-Performance Computing: Integrated into servers and workstations for caching and other performance-critical tasks.
  • Graphics Cards: Utilized as frame buffers and texture memory in graphics processing units (GPUs).
  • Military and Aerospace Systems: Deployed in radar systems, communication equipment, and other mission-critical applications.

Features:

  • High-Speed Operation: Offers fast access times and high bandwidth for demanding applications.
  • Synchronous Pipelined Burst Architecture: Enables efficient data transfer and reduces latency.
  • 64K x 36 Configuration: Provides a large memory capacity for storing significant amounts of data.
  • LVCMOS Compatible Inputs and Outputs: Ensures compatibility with a wide range of logic devices.
  • Single 3.3V Power Supply: Simplifies system design and reduces power consumption.

Benefits:

  • Improved System Performance: Enhances overall system performance by providing fast and reliable memory access.
  • Increased Bandwidth: Enables high-speed data transfer for demanding applications.
  • Reduced Latency: Minimizes delays in data access, improving responsiveness.
  • Simplified System Design: Eases system integration with its standard interface and power supply requirements.
  • Enhanced Reliability: Provides stable and reliable operation in demanding environments.

Additional Details:

The MT58LC64K36D8LG75 operates within a specified temperature range. The package type is typically a BGA (Ball Grid Array) for high-density mounting. Specific timing parameters, such as clock cycle time and access times, are detailed in the manufacturer's datasheet. It is designed to work in conjunction with a memory controller that manages the data flow. The '75' likely refers to the access time (7.5ns). Consult the datasheet for complete electrical characteristics and pinout information.

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