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HGTP12N60B3D

Part No HGTP12N60B3D
Manufacturer Intersil
Catalog Custom Parts (E - I)
Sample
Rohs State Need to verify
ECAD Module
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Peak Pulse Current 27 A
RoHS Non-Compliant
Win Source Part Number 1185710-HGTP12N60B3D
Categories Custom Parts
Manufacturer Intersil
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian HGTP12N60B3D CAD Model

Description

The HGTP12N60B3D is a high-voltage, fast-switching N-Channel IGBT (Insulated Gate Bipolar Transistor) manufactured by Intersil (now Renesas). This device is designed for high-power switching applications where efficiency, speed, and ruggedness are essential.

Applications

  • Uninterruptible Power Supplies (UPS)
  • Induction Heating
  • Welding Equipment
  • Power Factor Correction (PFC) circuits
  • Motor Control Drives

Features

  • N-Channel IGBT
  • High Voltage Capability (600V)
  • Fast Switching Speed
  • Low Saturation Voltage (VCE(sat))
  • High Input Impedance
  • Avalanche Energy Rated

Benefits

  • High Efficiency: Low VCE(sat) minimizes conduction losses, improving overall efficiency in power conversion applications.
  • Fast Switching: Reduces switching losses, enabling higher operating frequencies and improved system performance.
  • Robust Design: Avalanche energy rating ensures reliable operation under transient voltage conditions, enhancing system robustness.
  • Simplified Drive Circuitry: High input impedance simplifies the design of the gate drive circuit.
  • High Voltage Capability: Suitable for high-voltage applications, providing a wide operating range.

Additional Details

The HGTP12N60B3D is characterized by its collector-emitter voltage (VCE), gate-emitter voltage (VGE), and collector current (IC). Specific values for VCE(sat) at various collector currents and gate voltages, as well as thermal resistance characteristics, are critical for ensuring optimal performance and preventing device failure. Refer to the datasheet for detailed specifications.

Proper thermal management is crucial, especially in high-power applications. Techniques such as heat sinks or forced air cooling may be necessary to maintain the device within its operating temperature range. It is essential to avoid exceeding the absolute maximum voltage and current ratings to prevent damage.

The IGBT combines the advantages of both MOSFETs and bipolar transistors, offering high input impedance and low on-state voltage drop. This makes it an excellent choice for high-power switching applications where efficiency and speed are critical.

ESD precautions should be observed during handling and assembly to protect the device from electrostatic discharge damage.

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Shipping Information

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