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Same model may have multiple batches, images only for reference.
FW21555BBSL6G9
Same model may have multiple batches, images only for reference.

FW21555BBSL6G9

Part No FW21555BBSL6G9
Manufacturer Intel
Catalog OEM Parts (F - I)
Description Non Transparent PCI To PCI Bridge 304-Pin BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Mounting SMD (SMT)
Case / Package BGA
Maximum Operating Temperature 70 °C
Min Operating Temperature 0 °C
Radiation Hardening No
RoHS Compliant
Win Source Part Number 1060007-FW21555BBSL6G9
Categories OEM Parts(F-I)
Manufacturer Intel
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian FW21555BBSL6G9 CAD Model

Description

The Intel FW21555BBSL6G9 is an OEM part that is widely used in various applications. This component is manufactured by Intel, a leading global manufacturer of electronic components.

  • Supply and Demand Status: Short
  • Maximum Operating Temperature: 70 degrees Celsius
  • RoHS Compliant: Yes

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