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EP20K400CF672I8

Part No EP20K400CF672I8
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 488 I/O 672FBGA
Sample
Rohs State Need to verify
ECAD Module
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Categories Integrated Circuits (ICs)
Features series Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA
Manufacturer Intel
Series APEX-20KC®
Package Tray
Part Status Obsolete
Number of I/O 488
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 672-BBGA
Case / Package 672-FBGA (27x27)
Family Name EP20K400
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A2A
HTSUS 8542.39.0001
Quantity per package 40
Popularity High
Supply and Demand Status Balance
Win Source Part Number 918174-EP20K400CF672I8
Ultra Librarian 3D Model Ultra Librarian EP20K400CF672I8 CAD Model

Description

The EP20K400CF672I8 is a member of the APEX 20K family of Programmable Logic Devices (PLDs) from Intel (formerly Altera). This device is a high-density, high-performance programmable logic solution, designed for complex digital systems. The APEX 20K family combines the benefits of both gate arrays and standard cell ASICs with the flexibility of programmable logic.

Applications

  • Telecommunications Equipment: Used in networking infrastructure, such as routers, switches, and base stations, for data processing and signal management.
  • Industrial Automation: Employed in control systems, motor drives, and process automation for real-time decision-making and precise control.
  • Medical Imaging: Integrated into medical devices like MRI and CT scanners for image processing and data acquisition.
  • Aerospace and Defense: Utilized in avionics systems, radar processing, and communication systems due to its reliability and performance.
  • High-Performance Computing: Applied in servers and workstations for accelerating computationally intensive tasks.

Features

  • System-on-a-Programmable-Chip (SOPC) Integration: Allows for integrating various system-level functions onto a single chip, reducing board space and system cost.
  • Embedded Memory Blocks: Offers on-chip RAM blocks for data storage, enabling efficient memory access and reducing external memory requirements.
  • High Logic Density: Provides a large number of logic elements for implementing complex digital circuits. The EP20K400 offers 400,000 typical gates.
  • Flexible Routing Architecture: Features a robust routing network for connecting logic elements and memory blocks, ensuring high performance and efficient resource utilization.
  • Advanced I/O Capabilities: Supports a wide range of I/O standards and voltage levels, enabling seamless integration with other system components.
  • 672-Pin FineLine BGA Package: Provides high pin density and excellent thermal performance.

Benefits

  • Design Flexibility: Allows for easy modification and customization of digital circuits, enabling rapid prototyping and design iteration.
  • High Performance: Delivers high-speed operation and efficient resource utilization, enabling the implementation of demanding applications.
  • Reduced System Cost: Integrates multiple functions onto a single chip, reducing board space, component count, and overall system cost.
  • Time-to-Market Advantages: Enables rapid prototyping and design iteration, reducing time-to-market for new products.
  • Improved Reliability: Offers robust error detection and correction mechanisms, ensuring high reliability and data integrity.

The EP20K400CF672I8 features a 672-pin FineLine BGA package which is ideal for applications that require high pin counts and minimal board space. The I8 indicates an industrial temperature range of -40°C to 85°C.

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