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CY91F467RDPMC-GSE2

Part No CY91F467RDPMC-GSE2
Manufacturer Infineon Technologies
Catalog Embedded - Microcontrollers
Description IC MEM MM MCU AUTO / - Microcontroller IC
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - Microcontrollers
Mfr Infineon Technologies
Package Tray
Product Status Obsolete
Base Product Number CY91F467
Standard Package 40
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
Win Source Part Number 1347703-CY91F467RDPMC-GSE2
Ultra Librarian 3D Model Ultra Librarian CY91F467RDPMC-GSE2 CAD Model

Description

The CY91F467RDPMC-GSE2 is a microcontroller from Infineon Technologies, belonging to the CY91F family. This family is known for its application in automotive and industrial embedded systems. This particular model balances processing power, memory capacity, and peripheral functionality, making it suitable for real-time control and data processing applications.

Applications

  • Automotive Systems: Engine control units (ECUs), transmission control, body control modules (BCMs), and advanced driver-assistance systems (ADAS).
  • Industrial Automation: Programmable logic controllers (PLCs), motor control, sensor interfaces, and robotics.
  • Power Electronics: Digital power supplies, inverters, and converters.
  • Medical Devices: Portable monitoring systems, diagnostic equipment, and therapeutic devices.

Features

  • CPU Core: High-performance CPU core designed for efficient execution of complex algorithms.
  • Memory: Integrated flash memory for program storage, RAM for data storage, and EEPROM for non-volatile data storage.
  • Peripherals: Analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, counters, PWM modules, serial communication interfaces (UART, SPI, I2C, CAN).
  • Safety Features: Includes safety mechanisms such as watchdog timers, memory protection units, and error correction codes (ECC).
  • Operating Voltage: Wide operating voltage range to ensure reliable performance.
  • Temperature Range: Extended operating temperature range for automotive and industrial applications.
  • Package: Surface-mount package for efficient PCB assembly.

Benefits

  • Real-time Performance: Enables precise and timely control of external devices and processes.
  • System Integration: Combines multiple functions into a single chip, reducing the need for external components.
  • Cost-Effectiveness: Integrates various functions and features, reducing overall system cost.
  • Enhanced Reliability: Enhanced reliability and safety features for critical applications.
  • Ease of Development: Supported by a comprehensive development environment including compilers, debuggers, and emulators.
  • Power Efficiency: Optimized for low power consumption, enabling longer battery life in portable applications.

Additional Details

The CY91F467RDPMC-GSE2 includes on-chip debugging capabilities for simplified development and testing. It also supports various power-saving modes to further reduce power consumption when idle. Specific memory sizes and peripheral configurations can be found in the device datasheet.

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