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CY91F467RAPMC-GE1

Part No CY91F467RAPMC-GE1
Manufacturer Infineon Technologies
Catalog Embedded - Microcontrollers
Description IC MCU AUTO 176LQFP / - Microcontroller IC
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs) - Embedded - Microcontrollers
Mfr Infineon Technologies
Package Tray
Product Status Obsolete
Base Product Number CY91F467
Standard Package 40
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
Win Source Part Number 1347635-CY91F467RAPMC-GE1
Ultra Librarian 3D Model Ultra Librarian CY91F467RAPMC-GE1 CAD Model

Description

The CY91F467RAPMC-GE1 is a microcontroller unit (MCU) manufactured by Infineon Technologies. This MCU belongs to the CY91F family, known for its application in automotive and industrial embedded systems. This particular model provides a balance of processing power, memory, and peripheral features required for real-time control and data management.

Applications

  • Automotive electronics: Engine control, body control, chassis control, and safety systems (e.g., ABS, airbag control).
  • Industrial automation: Motor control, sensor interfaces, programmable logic controllers (PLCs), and robotics.
  • Power electronics: Inverters, converters, and power management systems.
  • Medical devices: Portable monitoring systems, diagnostic equipment, and therapeutic devices.

Features

  • CPU Core: High-performance CPU core designed for efficient execution of complex algorithms.
  • Memory: Integrated flash memory for program storage, RAM for data storage, and EEPROM for non-volatile data storage.
  • Peripherals: Analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, counters, PWM modules, and serial communication interfaces (UART, SPI, I2C, CAN).
  • Safety Features: Includes safety mechanisms such as watchdog timers, memory protection units, and error correction codes (ECC).
  • Operating Voltage: Designed to operate within a wide voltage range, ensuring reliable performance.
  • Temperature Range: Specified to operate within an extended temperature range suitable for automotive and industrial environments.
  • Package: Utilizes a surface-mount package for efficient PCB assembly.

Benefits

  • Real-time control: Enables precise and timely control of external devices and processes.
  • System integration: Combines multiple functions into a single chip, reducing the need for external components.
  • Cost-effectiveness: Integrates various functions and features, reducing the overall system cost.
  • High reliability: Enhanced reliability and safety features suitable for critical applications.
  • Ease of development: Supported by a comprehensive development environment, including compilers, debuggers, and emulators.
  • Power efficiency: Optimized for low power consumption, enabling longer battery life in portable applications.

Additional Details

The CY91F467RAPMC-GE1 features on-chip debugging capabilities, simplifying development and testing. It also supports various power-saving modes for reduced power consumption when idle. The specific memory sizes and peripheral configurations are detailed in the device datasheet.

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