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H5TQ2G63BFR-TEC

Part No H5TQ2G63BFR-TEC
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-2133 128Mx16 (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941126-H5TQ2G63BFR-TEC
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ2G63BFR-TEC CAD Model

Description

The Hynix H5TQ2G63BFR-TEC is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip that provides memory capacity and bandwidth for various applications. It is manufactured by Hynix Semiconductor, a leading memory solutions provider.

Applications

  • Networking Devices: Used in routers, switches, and other network infrastructure equipment.
  • Embedded Systems: Integrated into various embedded systems requiring memory.
  • Industrial Computing: Employed in industrial control systems and automation equipment.
  • Digital Signage: Used in digital signage players and displays.
  • Set-Top Boxes: Provides memory for set-top boxes and media players.

Features

  • 2Gb Density: Offers a memory capacity of 2 Gigabits.
  • DDR3 Technology: Provides high-speed data transfer rates compared to previous generation memory technologies.
  • FBGA Package: Uses a fine-pitch ball grid array for efficient board mounting and heat dissipation.
  • Operating Temperature: Designed to operate within a specified temperature range.
  • Low Power Consumption: Optimized for efficient power usage.

Benefits

  • Increased System Performance: Enables faster data processing, quicker application loading, and improved system responsiveness.
  • Reliable Operation: Designed for stable and dependable performance.
  • Higher Bandwidth: Supports high data transfer rates for demanding applications.
  • Lower Power Consumption: Reduces energy consumption, making it suitable for power-sensitive applications.
  • Compact Design: Allows for integration into smaller devices and systems.

Additional Details

The H5TQ2G63BFR-TEC operates at voltage levels defined by the DDR3 standard. Precise timing parameters are critical for system stability and performance, and are configured via the system's BIOS or memory controller. The chip's architecture facilitates parallel data access, increasing throughput. The 'TEC' speed grade indicates a specific performance level within the DDR3 specification. For detailed specifications, including voltage requirements, timing parameters, and thermal characteristics, refer to the official Hynix datasheet.

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Pricing & Ordering

Quantity Unit Price Ext. Price
7+ $9.1303 $63.9121
16+ $7.4913 $119.8608
24+ $7.2580 $174.1920
33+ $7.0236 $231.7788
43+ $6.7891 $291.9313
57+ $6.0869 $346.9533
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 2,582 pieces
MOQ: 7 pcs
Order Increment : 1 pcs
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