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CY7C16225PC

Part No CY7C16225PC
Manufacturer Cypress Semiconductor Corp
Catalog OEM Parts (C - E)
Description 16K X 4 Standard SRAM 25 Ns PDIP28
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1054278-CY7C16225PC
Categories OEM Parts(C-E)
Manufacturer Cypress Semiconductor Corp
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CY7C16225PC CAD Model

Description

The CY7C16225PC is a high-performance synchronous pipelined burst SRAM from Cypress Semiconductor. It is designed for applications requiring high bandwidth and low latency memory access. This SRAM offers a combination of speed and integration, making it suitable for demanding environments.

Applications:

  • Networking equipment: Routers, switches, and other network infrastructure devices utilize this SRAM for packet buffering and high-speed data transfer.
  • Telecommunications systems: Used in base stations and other telecom equipment for signal processing and data storage.
  • High-performance computing: Implemented in servers and workstations as a cache memory component to accelerate data access.
  • Test and measurement equipment: Employed in oscilloscopes, logic analyzers, and other instruments requiring rapid data capture and analysis.
  • Image processing and video applications: Found in frame buffers and other video processing systems for real-time data manipulation.

Features:

  • High-speed clock frequency: Supports fast clock speeds, enabling rapid data access.
  • Synchronous operation: Operates synchronously with a system clock for predictable timing and simplified control.
  • Pipelined burst architecture: Allows for efficient data transfer with minimal latency.
  • On-chip address counters: Simplify memory addressing and reduce external logic requirements.
  • Multiple burst modes: Offers various burst modes to optimize data transfer for different application needs.
  • Low power consumption: Designed for efficient power usage, making it suitable for power-sensitive applications.

Benefits:

  • Increased system performance: High-speed memory access improves overall system performance and responsiveness.
  • Reduced latency: Pipelined burst architecture minimizes latency, ensuring timely data delivery.
  • Simplified system design: On-chip features reduce the need for external components, simplifying system design.
  • Lower power consumption: Efficient power usage extends battery life in portable applications and reduces overall system power requirements.
  • Improved reliability: Robust design and manufacturing processes ensure reliable operation in demanding environments.

Additional Details:

The CY7C16225PC typically features a specific memory density and organization (e.g., 2Mb, organized as 64K x 36). It operates within a defined voltage range (e.g., 3.3V or 2.5V) and is available in various package options, such as TQFP or FBGA. Detailed timing parameters, such as clock-to-output delay and cycle time, are crucial for proper system integration and are specified in the product datasheet.

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