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Same model may have multiple batches, images only for reference.
HF115AC-0.0055-AC-90 Real Image
Same model may have multiple batches, images only for reference.

HF115AC-0.0055-AC-90

Part No HF115AC-0.0055-AC-90
Manufacturer Bergquist
Catalog Thermal - Pads, Sheets
Description THERM PAD 21.84MMX18.79MM W/ADH / Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side
Datasheet
HF115AC-0.0055-AC-90 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Fans, Thermal Management - Thermal - Pads, Sheets
Mfr Bergquist
Series Hi-Flow® 115-AC
Package Bulk
Usage TO-218, TO-220, TO-247
Type Pad, Sheet
Shape Rectangular
Outline 21.84mm x 18.79mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8W/m-K
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Base Product Number HF115AC
Standard Package 100
MSL Level 1 (Unlimited)
ECCN EAR99
HTSUS 3919.90.5060
Win Source Part Number 1351452-HF115AC-0.0055-AC-90
Ultra Librarian 3D Model Ultra Librarian HF115AC-0.0055-AC-90 CAD Model

Description

The Bergquist Hi-Flow 115-AC thermal pad/sheet is designed for use with TO-218, TO-220, and TO-247.

  • For Use With/Related Products: TO-218, TO-220, TO-247
  • Packaging: Bulk
  • Standard Package: 100
  • Thickness: 0.0055" (0.140mm)
  • Outline: 21.84mm x 18.79mm
  • Material: Phase Change Compound
  • Color: Gray
  • Shape: Rectangular
  • Adhesive: One Side
  • Backing, Carrier: Fiberglass
  • Thermal Resistivity: 0.35°C/W
  • Thermal Conductivity: 0.8W/m-K
  • REACH: Unaffected
  • HTSUS: 3919.90.5060
  • Manufacturer: Bergquist
  • Base Product Number: HF115AC

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