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Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z030
Standard Package 1 pcs
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Win Source Part Number 843854-XC7Z030-2FFG676E
Ultra Librarian 3D Model Ultra Librarian XC7Z030-2FFG676E CAD Model

Description

The XC7Z030-2FFG676E is an integrated circuit from the Zynq®-7000 series of System On Chip (SoC) devices from AMD.

  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ processor with CoreSight™ technology
  • Operating Speed: 800MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, and UART/USART
  • Peripheral: DMA
  • I/O Pins: 130
  • RAM: 256KB
  • FPGA: Kintex™-7 with 125K logic cells
  • Operating Temperature: 0°C to 100°C
  • Package: 676-BBGA, FCBGA

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $199.2367 $199.2367
2+ $178.6260 $357.2520
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 1,600 pieces
Order Increment : 1 piece
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