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MSM8260A2VV

Part No MSM8260A2VV
Manufacturer Yageo
Catalog OEM Parts (M - N)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1080556-MSM8260A2VV
Categories OEM Parts(M-N)
Manufacturer Yageo
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian MSM8260A2VV CAD Model

Description

The MSM8260A2VV is a system-on-chip (SoC) designed for mobile devices. While Yageo is primarily known for passive components, the MSM8260A2VV suggests a component within a larger chipset, likely related to wireless communication or processing within mobile phones or embedded systems. Given the 'MSM' prefix, it is probably a Qualcomm Snapdragon component rebranded or customized for a specific application.

Applications

  • Mobile phones
  • Tablets
  • Embedded systems with cellular connectivity
  • Portable media players

Features

  • Integrated CPU and GPU
  • Cellular modem capabilities (likely 3G/4G)
  • Wi-Fi and Bluetooth connectivity
  • GPS support
  • Multimedia processing capabilities (audio and video)

Benefits

  • Improved performance in mobile applications
  • Reduced power consumption
  • Enhanced multimedia experience
  • Seamless connectivity
  • Compact size for integration into mobile devices

Given its role in mobile devices, the MSM8260A2VV likely integrates multiple processing units, including a CPU for general-purpose computing and a GPU for graphics rendering. It would also incorporate a cellular modem for connecting to mobile networks, enabling voice calls, data transfer, and SMS messaging. Wi-Fi and Bluetooth capabilities allow for wireless connectivity to local networks and peripherals. The integrated GPS support enables location-based services and navigation applications.

Additional details, such as the specific CPU and GPU architectures, clock speeds, and supported memory types, would require accessing detailed datasheets or specifications from Qualcomm, as Yageo is acting as a supplier or distributor in this case. The power consumption characteristics and thermal management requirements would also be key considerations in the design of mobile devices using this component. It is likely fabricated using advanced CMOS process technology to achieve high performance and low power consumption.

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