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XCZU27DR-2FSVE1156I

Part No XCZU27DR-2FSVE1156I
Manufacturer Xilinx Inc.
Catalog Embedded Processors and Controllers
Description FPGA Zynq UltraScale+ 930300 Cells 775MHz 16nm 0.85V 1156-Ball BGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Max Frequency 4 GHz
Maximum Operating Temperature 100 °C
Number of ADC Channels 8
Number of Transceivers 16
RAM Size 1.6 MB
Speed Grade -2
Win Source Part Number 1009038-XCZU27DR-2FSVE1156I
Categories Embedded Processors and Controllers
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCZU27DR-2FSVE1156I CAD Model

Description

The XCZU27DR-2FSVE1156I is a high-performance UltraScale+ RFSoC (Radio Frequency System-on-Chip) from Xilinx. This advanced device integrates a programmable logic fabric with high-speed analog and digital converters, making it ideal for applications requiring real-time signal processing and high-bandwidth data acquisition. The 'DR' designation typically indicates a dual-core processor, enhancing its processing capabilities. Housed in a FSVE1156 package, which is a high-density flip-chip ball grid array (BGA) package with 1156 pins, the XCZU27DR-2FSVE1156I is designed for complex and demanding applications.

Applications

  • Wireless Communications: Used in 5G and other advanced wireless communication systems for baseband processing, channel estimation, and digital pre-distortion.
  • Radar Systems: Integrated into radar systems for signal processing, target detection, and beamforming.
  • Aerospace and Defense: Employed in electronic warfare systems, software-defined radios (SDRs), and signal intelligence (SIGINT) applications.
  • Test and Measurement Equipment: Utilized in high-performance oscilloscopes, spectrum analyzers, and signal generators.
  • Medical Imaging: Integrated into advanced medical imaging systems, such as MRI and ultrasound, for data acquisition and image reconstruction.

Features

  • RF Data Converters: Integrates high-speed analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) for direct RF sampling.
  • Programmable Logic: Features a high-performance programmable logic fabric based on the UltraScale+ architecture.
  • Embedded Processors: Includes ARM Cortex-A53 and Cortex-R5 processors for real-time control and application processing.
  • Memory Interfaces: Supports high-bandwidth memory interfaces, such as DDR4, for data storage and retrieval.
  • High-Speed Connectivity: Provides high-speed serial interfaces, such as PCIe and Ethernet, for data communication.

Benefits

  • High Performance: Delivers high performance for demanding signal processing and data acquisition applications.
  • Integration: Integrates multiple functions on a single chip, reducing system size, power consumption, and cost.
  • Flexibility: Offers high flexibility and programmability, allowing users to implement custom algorithms and protocols.
  • Real-Time Processing: Enables real-time processing of RF signals, making it suitable for time-critical applications.
  • Power Efficiency: Provides a balance between performance and power efficiency, optimizing system performance.

Additional Details

The XCZU27DR-2FSVE1156I operates at various voltage levels depending on the specific function (e.g., core voltage, I/O voltage). The -2 speed grade typically indicates a specific performance level within the UltraScale+ family. Detailed specifications, including the number of ADC/DAC channels, sampling rates, logic cells, memory capacity, and supported temperature ranges, are available in the device datasheet provided by Xilinx. Proper power supply design, thermal management, and signal integrity are critical for ensuring stable and reliable operation. Design and implementation involve using Xilinx's Vivado Design Suite, which provides tools for design entry, simulation, place and route, and programming. Understanding the device's architecture, features, and limitations is essential for successful integration into the target system, enabling optimal performance and system reliability. The 'I' at the end of the part number indicates an industrial temperature grade.

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