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XCVU095-1FFVD1517I

Part No XCVU095-1FFVD1517I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description FPGA Virtex UltraScale Family 1176000 Cells 20nm Technology 0.95V 1517-Pin FCBGA Tray
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Number of Transceivers 32
RoHS Non-Compliant
Speed Grade 1
Win Source Part Number 1009917-XCVU095-1FFVD1517I
Categories Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCVU095-1FFVD1517I CAD Model

Description

The XCVU095-1FFVD1517I is a Virtex UltraScale FPGA (Field-Programmable Gate Array) manufactured by Xilinx Inc. It belongs to the Virtex UltraScale family, known for its high performance and power efficiency. These FPGAs are designed for a wide range of demanding applications requiring high-speed data processing and complex logic implementation.

Applications:

  • Data centers (servers, network switches)
  • Telecommunications (wireless base stations, optical transport networks)
  • Aerospace and defense (radar systems, electronic warfare)
  • Medical imaging (MRI, CT scanners)
  • High-performance computing (HPC)

Features:

  • UltraScale architecture
  • 942,720 logic cells
  • 1,180,800 KB Block RAM
  • 2,712 DSP slices
  • 32 high-speed transceivers (up to 32.75 Gbps)
  • 1517-pin flip-chip BGA package

Benefits:

  • High performance for demanding applications
  • Low power consumption for energy efficiency
  • Flexibility to implement custom logic designs
  • High-speed transceivers for fast data transfer
  • Large logic capacity for complex designs

Technical Specifications:

The XCVU095-1FFVD1517I operates from a core voltage of typically 0.85V. It features a large number of configurable logic blocks (CLBs) and block RAM. The FPGA includes numerous DSP slices for accelerating signal processing algorithms. The high-speed transceivers support a variety of protocols, including PCIe, Ethernet, and CPRI. The device is packaged in a flip-chip BGA (ball grid array) package for improved thermal performance. It's designed to operate over an industrial temperature range. The XCVU095-1FFVD1517I is commonly programmed using the Xilinx Vivado Design Suite.

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