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XCV300-6FG456I

Part No XCV300-6FG456I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Sample
Rohs State Need to verify
ECAD Module
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Case / Package FBGA
RoHS Non-Compliant
Win Source Part Number 1206363-XCV300-6FG456I
Categories Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XCV300-6FG456I CAD Model

Description

The XCV300-6FG456I is a Field-Programmable Gate Array (FPGA) from Xilinx, part of the Virtex series. It is a programmable logic device that allows designers to implement custom digital circuits for various applications. The "-6" denotes the speed grade, and the "FG456" indicates a Fine-Pitch Ball Grid Array (FBGA) package with 456 pins. The "I" signifies that it's intended for industrial temperature range.

Applications:

  • Digital signal processing (DSP)
  • Image and video processing
  • Networking and telecommunications equipment
  • Industrial automation
  • Aerospace and defense systems
  • Medical imaging
  • Custom logic implementation

Features:

  • 324 Logic Cells
  • 300,000 System Gates
  • Flexible clocking resources
  • Configurable I/O pins
  • On-chip RAM blocks
  • Advanced routing architecture
  • Industrial temperature range operation

Benefits:

  • Design Flexibility: FPGAs allow for custom logic implementation, enabling designers to tailor the hardware to their specific application requirements.
  • High Performance: Provides high-speed processing capabilities for demanding applications.
  • Reprogrammability: The device can be reprogrammed multiple times, allowing for design changes and updates without replacing the hardware.
  • Time-to-Market: Reduces development time compared to designing custom ASICs (Application-Specific Integrated Circuits).
  • Industrial Temperature Range: Suitable for applications requiring operation in harsh environments.

Detailed Description:

The XCV300-6FG456I is built on a state-of-the-art architecture that balances performance, flexibility, and cost. Its configurable logic blocks (CLBs) and programmable interconnects allow designers to create complex digital circuits. The on-chip RAM blocks provide local memory storage for data processing. The device is programmed using Hardware Description Languages (HDLs) such as VHDL or Verilog and Xilinx's development tools.

Technical Specifications:

  • Number of Logic Cells: 324
  • System Gates: 300,000
  • Maximum User I/O: Approximately 300 (depending on configuration)
  • Internal RAM: Block RAM, typically in the range of tens of kilobytes
  • Clock Management: Digital Clock Managers (DCMs) for clock synthesis and management
  • Supply Voltage: Typically 2.5V or 3.3V (core voltage)
  • Package: Fine-Pitch Ball Grid Array (FBGA) with 456 pins
  • Operating Temperature: -40°C to +100°C (Industrial)

The XCV300-6FG456I is a versatile and powerful FPGA suitable for a wide range of applications, particularly those requiring high performance, design flexibility, and operation in industrial environments. Its reprogrammability and advanced features make it a valuable tool for digital system designers.

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