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XCF08PFG48BRT

Part No XCF08PFG48BRT
Manufacturer Xilinx Inc.
Catalog OEM Parts (T - Z)
Description XCF08PFG48BRT Xilinx
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Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1029453-XCF08PFG48BRT
Categories OEM Parts(T-Z)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCF08PFG48BRT CAD Model

Description

The XCF08PFG48BRT is a configuration PROM (Platform Flash PROM) from Xilinx, specifically designed for configuring Xilinx FPGAs. It belongs to the XCFxxS series, known for their reliability and ease of use. This PROM stores the configuration data necessary to define the functionality of the FPGA upon power-up.

Applications

  • Xilinx FPGA Configuration: Primary application is to store configuration bitstreams for Xilinx FPGAs.
  • Embedded Systems: Used in a variety of embedded applications where FPGAs provide reconfigurable logic.
  • Industrial Control: Configures FPGAs in industrial automation and control systems.
  • Networking Equipment: Bootloads FPGAs within routers, switches, and other network devices.
  • Aerospace and Defense: Used in high-reliability applications requiring configurable logic.

Features

  • 8 Mbit Density: Provides 8 Mbits of storage capacity for FPGA configuration data.
  • In-System Programmable (ISP): Allows for updating the configuration data without removing the PROM from the board.
  • Low Power Consumption: Designed for low power operation, suitable for battery-powered applications.
  • Fast Configuration Loading: Ensures quick and efficient loading of the FPGA configuration data.
  • 48-Pin Thin Fine Pitch Quad Flatpack (TQFP) Package: Compact package for space-constrained applications.
  • RoHS Compliant: Meets environmental standards for hazardous substance reduction.

Benefits

  • Flexibility: In-system programmability enables easy updates and modifications to the FPGA configuration.
  • Simplified Design: Offers a straightforward method for configuring Xilinx FPGAs, reducing design complexity.
  • Reduced Power Consumption: Low power operation contributes to longer battery life in portable devices.
  • Faster Time-to-Market: Allows for rapid prototyping and development of FPGA-based systems.
  • Space-Saving Design: The compact package minimizes board space requirements.
  • High Reliability: Ensures reliable FPGA configuration with robust design and manufacturing processes.

Technical Specifications:

  • Memory Size: 8 Mbit
  • Supply Voltage: Typically 3.3V
  • Operating Temperature: Typically 0°C to +70°C (Commercial)
  • Package Type: 48-Pin TQFP
  • Programming Interface: JTAG or Serial

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