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XC7K325T3FFG900C

Part No XC7K325T3FFG900C
Manufacturer Xilinx Inc.
Catalog Custom Parts (U - Z)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1179750-XC7K325T3FFG900C
Categories Custom Parts
Manufacturer Xilinx Inc.
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC7K325T3FFG900C CAD Model

Description

The XC7K325T-3FFG900C is a Kintex-7 series FPGA (Field-Programmable Gate Array) from Xilinx. It is designed for a wide range of applications requiring high-performance and low-power consumption.

Applications

  • Wireless communications
  • Data centers
  • Medical imaging
  • Industrial automation
  • Aerospace and defense
  • Video processing

Features

  • 326,080 logic cells
  • 16,200 KB block RAM
  • 1,070 user I/Os
  • 32 high-performance transceivers (up to 12.5 Gbps)
  • Integrated memory controllers
  • 900-pin fine-pitch ball grid array (FBGA) package

Benefits

  • High performance and flexibility
  • Low power consumption
  • High-speed data transfer
  • Rapid prototyping and development
  • Scalable architecture

Additional Details

The XC7K325T-3FFG900C belongs to the Kintex-7 family, built on a 28nm process technology. This FPGA features a large number of logic cells, allowing for complex digital circuits to be implemented. The generous amount of block RAM provides ample storage for data and instructions. The high number of user I/Os enables the device to interface with a wide range of external components. The 32 high-performance transceivers provide high-speed data transfer capabilities, which are essential for applications such as wireless communications and data centers. The integrated memory controllers simplify the design of systems with external memory. The C speed grade specifies the temperature range, indicating standard commercial temperature range usage. Xilinx's Vivado Design Suite provides a comprehensive environment for designing and implementing applications for the XC7K325T-3FFG900C. The FPGA's reconfigurable nature allows designers to make changes to the design even after the device has been deployed. It's a versatile solution for applications demanding high performance and flexibility in a power-efficient manner. This particular model is designed for high-volume production runs and provides an optimal balance of performance, power, and cost.

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