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XC3S400A-4FG320C

Part No XC3S400A-4FG320C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description FPGA Spartan-3A Family 400K Gates 8064 Cells 667MHz 90nm Technology 1.2V 320-Pin F-BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Mounting SMD (SMT)
Case / Package BGA
Maximum Operating Temperature 85 °C
Min Operating Temperature 0 °C
Mount Surface Mount
Number of Gates 400000
Number of I/Os 251
Number of Logic Blocks (LABs) 896
Number of Logic Elements/Cells 8064
Number of Pins 320
Operating Supply Voltage 1.2 V
RAM Size 45 kB
RoHS Compliant
Speed Grade 4
Win Source Part Number 1105312-XC3S400A-4FG320C
Categories Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XC3S400A-4FG320C CAD Model

Description

The Xilinx XC3S400A-4FG320C is a member of the Spartan-3A family of Field Programmable Gate Arrays (FPGAs). These FPGAs are designed for cost-sensitive applications that require a balance of performance, features, and low power consumption. The Spartan-3A family builds upon the success of previous Spartan generations, offering improved performance and enhanced features.

Applications

  • Consumer Electronics: Set-top boxes, DVD players, and digital cameras.
  • Industrial Automation: Programmable logic controllers (PLCs), motor control, and sensor interfaces.
  • Automotive Electronics: Body control modules, infotainment systems, and driver assistance systems.
  • Communication Systems: Wireless transceivers, network interface cards (NICs), and data acquisition systems.
  • Medical Devices: Portable diagnostic equipment, patient monitoring systems, and medical imaging devices.

Features

  • 400,000 System Gates: Provides a significant amount of programmable logic for implementing complex designs.
  • Advanced Low-Power Architecture: Minimizes power consumption for battery-powered and energy-efficient applications.
  • Flexible I/O: Supports a wide range of I/O standards and interfaces.
  • Embedded Multipliers: Provides dedicated hardware multipliers for high-speed arithmetic operations.
  • On-Chip Memory: Block RAM provides storage for data and instructions, enabling efficient data processing.
  • Digital Clock Manager (DCM): Allows for flexible clock generation and management.
  • 320-Pin Fine-Pitch Ball Grid Array (FBGA) Package: Provides a high pin count for maximum I/O connectivity in a compact footprint.

Benefits

  • Cost-Effectiveness: Offers a competitive price point for cost-sensitive applications.
  • Low Power Consumption: Reduces power requirements and extends battery life.
  • Design Flexibility: Allows for easy modification and reconfiguration of designs.
  • Fast Time-to-Market: Enables rapid prototyping and development of custom hardware.
  • Performance: Offers a balance of performance and features for a wide range of applications.

Additional Details

The XC3S400A-4FG320C is fabricated using a 90nm process technology. It operates with a core voltage of 1.2V. The “-4” speed grade indicates the relative performance of the device, and the “C” signifies commercial temperature grade. The FG320 package offers a compact footprint and efficient thermal performance. Refer to the Xilinx datasheet for specific details, including the number of logic cells, block RAM size, and I/O counts. The Xilinx ISE or Vivado design suites are used to program and configure these FPGAs.

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