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XC2V80-6FG256C

Part No XC2V80-6FG256C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
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Category Integrated Circuits(ICs)
Family Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Win Source Part Number 412542-XC2V80-6FG256C
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC2V80-6FG256C CAD Model

Description

The XC2V80-6FG256C is a low-density member of the Virtex-II family of Field-Programmable Gate Arrays (FPGAs) from Xilinx. It provides a cost-effective solution for implementing basic digital logic functions in a compact footprint. The FG256C indicates a Fine-Pitch Ball Grid Array (FBGA) package with 256 pins.

Applications:

  • Interface Controllers: Designed for interfacing between different devices and systems, such as memory controllers and peripheral interfaces.
  • Glue Logic: Employed as glue logic to connect and control various components in a digital system.
  • State Machines: Implemented for controlling the behavior of digital systems based on input signals and internal states.
  • Address Decoding: Utilized for decoding memory addresses and selecting specific memory locations.
  • Small Embedded Systems: Found in low-complexity embedded applications where minimal processing power is required.

Features:

  • Configurable Logic Blocks (CLBs): Provides a flexible architecture for implementing custom logic functions.
  • Block RAM: Includes on-chip memory blocks for data storage and buffering, allowing for efficient data manipulation.
  • Digital Clock Manager (DCM): Offers precise clock control and management, crucial for timing-sensitive applications.
  • Versatile I/O: Supports a range of I/O standards for interfacing with external peripherals, enabling seamless integration with other components.
  • Fine-Pitch BGA Package: The 256-pin FBGA package enables high pin density and good thermal performance, facilitating efficient heat dissipation.

Benefits:

  • Low Cost: Provides a cost-effective solution for basic digital logic applications, minimizing overall system expenses.
  • Compact Size: The FBGA package enables integration into small form-factor systems, reducing board space requirements.
  • Design Flexibility: Programmable logic allows for customization and adaptation to specific application needs, providing a tailored solution.
  • Fast Prototyping: Enables rapid development and testing of digital circuits, accelerating the design process.
  • Reduced Time-to-Market: Speeds up the development cycle with its programmable nature, allowing for quicker product releases.

Additional Details:

The XC2V80-6FG256C operates at a -6 speed grade, which determines its performance characteristics. It contains configurable logic blocks (CLBs) arranged in a regular array, interconnected by a programmable routing network, providing a flexible and adaptable architecture. The device also includes dedicated resources for arithmetic operations, such as multipliers and adders, enhancing its processing capabilities. The FBGA package facilitates surface mounting and provides good thermal conductivity, ensuring reliable operation. The device's configuration data can be loaded through various interfaces, including JTAG, SPI, and parallel interfaces, offering flexibility in programming options.

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