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THGBM9G9T8KBAIG

Part No THGBM9G9T8KBAIG
Manufacturer Toshiba Semiconductor and Storage
Catalog Electronic Wholesale
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 2015+
Reference case TFBGA-153
Manufacturer Toshiba Semiconductor and Storage
Manufacturer Homepage www.semicon.toshiba.co.jp/eng
Win Source Part Number 757401-THGBM9G9T8KBAIG
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian THGBM9G9T8KBAIG CAD Model

Description

The THGBM9G9T8KBAIG is an embedded MultiMediaCard (eMMC) NAND flash memory device manufactured by Toshiba Semiconductor and Storage. eMMC devices are commonly used for mass storage in mobile devices and embedded systems, providing a reliable and compact storage solution.

Applications

  • Smartphones: Provides storage for operating systems, applications, and user data in smartphones.
  • Tablets: Stores the operating system, applications, and user data in tablet computers.
  • E-readers: Used for storing e-books, documents, and other content in e-readers.
  • Digital Cameras: Stores photos and videos in digital cameras.
  • Gaming Consoles: Provides storage for game data, operating systems, and other content in portable gaming consoles.
  • Embedded Systems: Used in various embedded systems, such as industrial computers, medical devices, and automotive systems, for storing program code and data.

Features

  • NAND Flash Memory: Utilizes NAND flash memory technology for high-density storage and non-volatile data retention.
  • eMMC Interface: Employs the eMMC interface for fast and reliable data transfer.
  • Managed NAND: Includes a built-in controller that manages the NAND flash memory, simplifying the integration process and improving performance.
  • Power Management: Integrated power management features optimize power consumption and extend battery life in portable devices.
  • Wear Leveling: Implements wear leveling algorithms to distribute write/erase cycles evenly across the memory cells, extending the lifespan of the device.
  • Error Correction Code (ECC): Incorporates ECC to detect and correct errors, ensuring data integrity.

Benefits

  • High Storage Capacity: Provides ample storage space for operating systems, applications, and user data.
  • Fast Data Transfer: eMMC interface allows for fast and reliable data transfer, improving system performance.
  • Simplified Integration: Managed NAND simplifies the integration process, reducing development time and cost.
  • Low Power Consumption: Power management features optimize power consumption, extending battery life in portable devices.
  • Long Lifespan: Wear leveling algorithms extend the lifespan of the device, ensuring reliable operation over time.
  • Data Integrity: ECC ensures data integrity, preventing data corruption and loss.

Additional Details

The THGBM9G9T8KBAIG is typically available in various storage capacities. The eMMC interface supports high-speed data transfer rates, enabling fast boot times and application loading. The device incorporates advanced NAND management techniques, such as wear leveling and bad block management, to ensure optimal performance and reliability. The eMMC standard simplifies the integration of NAND flash memory into embedded systems, reducing the complexity of memory management.

The THGBM9G9T8KBAIG is designed to meet the demanding requirements of mobile devices and embedded systems, offering a high-performance, low-power, and reliable storage solution. Its compact size and robust feature set make it an ideal choice for a wide range of applications.

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $27.8794 $83.6382
6+ $22.8759 $137.2554
8+ $22.1610 $177.2880
11+ $21.4460 $235.9060
14+ $20.7311 $290.2354
19+ $18.5863 $353.1397
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 6,300 pieces
MOQ: 3 pcs
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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