The THGBM2G7D4FBAI9DGH is an e-MMC (embedded MultiMediaCard) NAND flash memory device manufactured by Toshiba Semiconductor and Storage. e-MMC is a widely used storage solution in various consumer electronics and industrial applications due to its compact size, high performance, and ease of integration. This particular e-MMC device offers a specific storage capacity and is designed to meet the demanding requirements of modern embedded systems.

Applications

• Smartphones and Tablets: Used as the primary storage for operating systems, applications, and user data.
• Embedded Systems: Integrated into various embedded systems requiring non-volatile storage, such as industrial control systems and automotive infotainment.
• Digital Cameras and Camcorders: Stores captured images and videos.
• Gaming Consoles: Provides storage for game data, operating systems, and downloadable content.

Features

• e-MMC Interface: Compliant with the JEDEC e-MMC standard, ensuring compatibility and ease of integration.
• NAND Flash Memory: Utilizes NAND flash memory technology for high-density storage and fast read/write speeds.
• Managed Memory: Includes built-in controller for memory management functions such as wear leveling, error correction, and bad block management.
• High-Speed Data Transfer: Supports high-speed data transfer rates, enabling quick boot times and application loading.
• Low Power Consumption: Designed for low power consumption, making it suitable for portable devices.

Benefits

• High Performance: Enables fast boot times, quick application loading, and smooth multimedia playback.
• Reliable Storage: Built-in error correction and wear leveling mechanisms ensure data integrity and prolong the lifespan of the device.
• Compact Size: Small form factor allows for integration into space-constrained devices.
• Easy Integration: Standard e-MMC interface simplifies the integration process, reducing development time and costs.
• Cost-Effective: Offers a cost-effective storage solution for various applications.

Additional Details

The THGBM2G7D4FBAI9DGH e-MMC device typically operates within a specific voltage range (e.g., 2.7V to 3.6V) and supports various operating temperature ranges. It is available in a ball grid array (BGA) package for surface mount assembly. Specific technical specifications such as storage capacity, data transfer rates, and power consumption can be found in the official Toshiba datasheet for this part number.