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TH58TFT1DFLBA8PDDK

Part No TH58TFT1DFLBA8PDDK
Manufacturer Toshiba Semiconductor and Storage
Catalog OEM Parts (T - Z)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1009849-TH58TFT1DFLBA8PDDK
Categories OEM Parts(T-Z)
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian TH58TFT1DFLBA8PDDK CAD Model

Description

The TH58TFT1DFLBA8PDDK is a NAND flash memory chip manufactured by Toshiba Semiconductor and Storage. This type of memory is widely used for non-volatile data storage in a variety of electronic devices due to its high density, low cost, and good performance characteristics.

Applications

  • Solid State Drives (SSDs): Used as the primary storage medium in SSDs.
  • USB Flash Drives: Found in USB flash drives for portable data storage.
  • Memory Cards: Used in SD cards, microSD cards, and other memory card formats.
  • Mobile Devices: Integrated into smartphones and tablets for internal storage.
  • Embedded Systems: Used in embedded systems for storing firmware and data.

Features

  • NAND Flash Technology: Utilizes NAND flash technology for high-density storage.
  • High Storage Capacity: Offers significant storage capacity in a small package.
  • Fast Read/Write Speeds: Provides relatively fast read and write speeds compared to traditional storage devices.
  • Low Power Consumption: Operates with low power consumption, extending battery life in portable devices.
  • Non-Volatile Memory: Retains data even when power is removed.

Benefits

  • High Density Storage: Enables the storage of large amounts of data in a compact form factor.
  • Fast Performance: Improves system performance with quick data access times.
  • Energy Efficiency: Reduces power consumption, extending battery life in portable devices.
  • Reliable Data Storage: Provides reliable and secure data storage.
  • Durable: Offers good durability and resistance to shock and vibration.

Additional Details

The TH58TFT1DFLBA8PDDK is likely a specific density of NAND flash, such as 128Gb or 256Gb. The exact specifications, including the interface type (e.g., ONFI, Toggle DDR), voltage requirements, and operating temperature range, are detailed in the product datasheet. These NAND flash chips are often used in conjunction with a flash memory controller, which manages the complex operations of reading, writing, and erasing data. The package type is typically a BGA (Ball Grid Array) for surface mounting. Key parameters include the program/erase cycles, which indicate the number of times the memory can be written to before potential degradation. NAND flash memory is an essential component in modern electronic devices, enabling the storage and retrieval of vast amounts of data.

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