The TC74VCX573FT is an octal D-type latch manufactured by Toshiba Semiconductor and Storage. It is part of the VCX family, characterized by low-voltage operation and high-speed performance. This device is designed for temporary data storage and is often used in applications such as memory interfacing, data multiplexing, and input/output port expansion. It comes in a TSSOP (Thin Shrink Small Outline Package), suitable for high-density board designs.

Applications

• Memory interface latching
• Data multiplexing
• Input/output port expansion
• Address latching
• General-purpose data storage

Features

• Low-voltage operation: 1.65 V to 3.6 V
• High-speed performance: tpd = 2.8 ns (typical) at 3.3 V
• Output current drive: |IOH|/IOL = 24 mA (min) at VCC = 3.0 V
• TTL-compatible inputs
• Power-down protection on inputs and outputs
• TSSOP package for high-density mounting

Benefits

• Improved system performance due to high-speed operation
• Reduced power consumption due to low-voltage operation
• Increased board density due to small package size
• Enhanced system reliability due to power-down protection
• Simplified interfacing with TTL devices

Additional Details

The TC74VCX573FT features eight D-type latches. Each latch has a data input (D) and an output (Q). The latches are controlled by a latch enable (LE) input. When LE is high, the Q outputs follow the D inputs. When LE transitions low, the data present at the D inputs is latched and held at the Q outputs. An Output Enable (OE) input controls the output state. When OE is low, the outputs are enabled. When OE is high, the outputs are in a high-impedance state. The power-down protection feature prevents current leakage when the supply voltage is removed. The operating temperature range is -40°C to +85°C.

This latch is frequently used in digital systems where temporary data storage is required. Its low-voltage operation makes it suitable for portable and battery-powered devices. The high output drive capability allows it to drive heavily loaded buses without signal degradation. Its small package size makes it ideal for applications where board space is limited.