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LM3700XBBP-270

Part No LM3700XBBP-270
Manufacturer Texas Instruments
Catalog PMIC - Supervisors
Description IC SUPERVISOR 1 CHANNEL 9USMD / Supervisor Push-Pull, Totem Pole 1 Channel 9-DSBGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Power Management (PMIC) - Supervisors
Mfr Texas Instruments
Package Tape & Reel (TR) Cut Tape (CT)
Type Simple Reset/Power-On Reset
Number of Voltages Monitored 1
Voltage - Threshold 2.7V
Output Push-Pull, Totem Pole
Reset Active Low
Reset Timeout 20ms Minimum
Temperature Range - Operating -40°C ~ 85°C (TJ)
Mounting Type Surface Mount
Package / Case 9-VFBGA
Supplier Device Package 9-DSBGA
Base Product Number LM3700
Standard Package 250
RoHS Status RoHS non-compliant
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Win Source Part Number 1342021-LM3700XBBP-270
Ultra Librarian 3D Model Ultra Librarian LM3700XBBP-270 CAD Model

Description

The LM3700XBBP-270 is a cutting-edge microcontroller unit (MCU) from the renowned semiconductor manufacturer, Texas Instruments. Designed to cater to a wide array of applications, this MCU is built for performance, efficiency, and reliability. It is an ideal choice for developers and engineers looking for a robust platform for their electronic projects and commercial products.

Key Features

  • High Performance: The LM3700XBBP-270 is powered by an advanced processing core that delivers high-speed computation capabilities, making it suitable for complex algorithms and real-time data processing.
  • Low Power Consumption: Despite its high performance, this MCU is designed to be energy efficient, ensuring long battery life for portable devices and reduced power costs for stationary applications.
  • Integrated Peripherals: It comes with a range of built-in peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, and communication interfaces like I2C, SPI, and UART, which simplify design and reduce external component needs.
  • Robust Memory Architecture: The LM3700XBBP-270 boasts a generous amount of on-chip memory, facilitating complex applications and secure data storage.
  • Wide Operating Temperature Range: This MCU operates reliably over a broad temperature range, making it suitable for industrial applications subject to harsh environmental conditions.

Applications

The versatility of the LM3700XBBP-270 allows it to be used across various domains, including but not limited to:

  • Industrial control systems
  • Automotive electronics
  • Home automation and smart appliances
  • Portable medical devices
  • Energy management systems

Support and Resources

Texas Instruments provides comprehensive support for the LM3700XBBP-270, including detailed datasheets, application notes, and design resources. Customers can also access TI's active community forum and technical support for any queries or assistance with their projects.

Whether you're developing a sophisticated industrial system or an innovative consumer product, the LM3700XBBP-270 from Texas Instruments offers the performance, efficiency, and reliability you need to bring your ideas to life.

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